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NTHD3133PF
Power MOSFET and
Schottky Diode
-20 V, FETKY t , P-Channel, -4.4 A, with
3.7 A Schottky Barrier Diode, ChipFET t
Features
? Leadless SMD Package Featuring a MOSFET and Schottky Diode
? 40% Smaller than TSOP-6 Package
? Leadless SMD Package Provides Great Thermal Characteristics
? Independent Pinout to each Device to Ease Circuit Design
? Trench P-Channel for Low On Resistance
? Ultra Low V F Schottky
? These are Pb-Free Devices
Applications
? Li-Ion Battery Charging
? High Side DC-DC Conversion Circuits
? High Side Drive for Small Brushless DC Motors
? Power Management in Portable, Battery Powered Products
V (BR)DSS
-20 V
V R MAX
20 V
G
http://onsemi.com
MOSFET
R DS(on) TYP
64 m W @ -4.5 V
85 m W @ -2.5 V
SCHOTTKY DIODE
V F TYP
0.35 V
S
A
I D MAX
-4.4 A
I F MAX
3.7 A
MOSFET MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Symbol
V DSS
V GS
Value
-20
± 8.0
Units
V
V
D
P-Channel MOSFET
C
Schottky Diode
Continuous Drain
Current (Note 1)
Steady
State
T J = 25 ° C
T J = 85 ° C
I D
-3.2
-2.3
A
8
ChipFET
CASE 1206A
t ≤ 5s
T J = 25 ° C
-4.4
1
STYLE 3
Power Dissipation
(Note 1)
Steady
State
T J = 25 ° C
P D
1.1
W
t ≤ 5s
2.1
Pulsed Drain Current
t p = 10 m s
I DM
-13
A
PIN
MARKING
Operating Junction and Storage Temperature
T J , T STG
-55 to
° C
CONNECTIONS
DIAGRAM
150
1
8
Source Current (Body Diode)
I S
2.5
A
A
C
1
8
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
A
2
7
6
C
2
7
SCHOTTKY DIODE MAXIMUM RATINGS
(T J = 25 ° C unless otherwise noted)
S
G
3
D
D
3
4
6
5
Parameter
Peak Repetitive Reverse Voltage
DC Blocking Voltage
Symbol
V RRM
V R
Value
20
20
Units
V
V
4
5
DA = Specific Device Code
M = Month Code
Average Rectified
Steady
I F
2.2
V
G
= Pb-Free Package
Forward Current
State
T J = 25 ° C
t ≤ 5s 3.7 A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2007
October, 2007 - Rev. 0
1
Publication Order Number:
NTHD3133PF/D
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